Shenzhen GreatPCB Electronics Co.,Ltd

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1. 4 L,Buried Vias OSP

4 layers Buried Vias and Au Plating,OSP

2. 5 L,immersion Ni/Au

5 layers Flexible, Cu, PI and ADH, immersion Ni/Au

3. 10 L,Flash gold finger

10 layers , FR4, Flash and gold finger, Impedance control.

4. 6 L, Gold plating

6 layers FR4, Gold plating, blue solder mask

5. 8 layers ,FR4, immersion gold, Thickness,4mm

8 layers board
Basic Material: FR-4
Board Ply (thickness): 4.0mm
Measurement: 254mm*304.8mm
Conductor Width: 5mil (0.13mm)
Conductor Spacing: 5mil (0.13mm)
SurfaceTreatment: Immersion gold
File Format: Gerber File (RS274X)
Through Hole: ...

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